Aiden
Azarnoush

Secondary flow and thermal analysis of high-pressure turbine hardware on quality notifications (QNs) — clearance and thermal-gradient studies across conduction, convection, and radiation, supporting seal and knife-edge work and engine-manual limit evaluations.

Built the RTP (Return-Through Tightness Parameter) tool to determine optimal tip-shroud configurations on PW4000 shrouded blades and disk sectors — running steady-stress, thermal, and modal analysis across operating conditions and evaluating thermal and modal allowances and margins for wear, creep, untwist, and tolerance.

Python wrapper for MIT MISES 2D cascade analysis that prepares the required input files across spanwise sections (ISET grid setup, ISES inviscid and viscous solutions) and extracts the results — removing manual setup from QN evaluations and standardizing outputs across the team.

In-house LE/TE blending tool for turbine blade edges, later extended to surface blends. Supports multiple blend methods — sphere- and ellipsoid-based — with control over how deeply the blend penetrates toward the blade core, wrapped in a GUI for consistent, repeatable results across blade alloys.

Enhanced a legacy Monte Carlo particle-ingestion tool, adding a kinetic-energy-based dirt-breakup model and increasing the particle count to improve simulation fidelity.

• Simplified model geometry to strip small features insignificant to the thermal result before meshing.
• Built high-fidelity models by importing the full PCB stackup — layers, vias, and copper distribution — from ODB++ / ECAD files.
• For reduced-fidelity work, modeled each circuit-card-assembly (CCA) component by its junction-to-case and junction-to-board thermal resistances — splitting each into halves with conductivities derived from the manufacturer’s rated thermal resistance — and estimated effective board conductivity by hand calculation or in ANSYS.
• Modeled extreme operating environments — space vacuum, solar loading, rainstorm, water immersion, varying elevation — in ANSYS Icepak, Fluent, CFX, and Steady-State Thermal.
• Specified cooling solutions (component placement, fans, heat pipes, TIMs, surface coatings) and fed results into chassis redesign and optimization.

• Ran modal analysis to find each assembly’s natural modes and the direction it deflects — the first mode being critical and the basis for the vibration runs.
• Performed random vibration in all three orthogonal axes from the acceleration spectral-density profile, using linear modal superposition with ~100 modes to capture at least 86% of the modal mass.
• Found the maximum deflection of each surface-mount component along worst-case paths and predicted margins of safety for all parts.
• Performed shock and drop-test analysis from the shock profile (peak acceleration vs. natural frequency) in the X and Y directions.
• Ran static, dynamic, and differential-pressure analysis, and determined fatigue life and margin of safety for chassis and PCBs.

• Developed a nonlinear finite-element C++ code to model high-cycle fatigue crack propagation in brittle polycrystalline materials.
• Implemented an SVPN-based numerical method in FORTRAN to determine the microscopic yield (Peierls) stress in solder and pure titanium.